ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints
This paper presents an optimized curing process for the Pre-Rolls shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections.The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and curing time t is established.The influence of